R&D towards a novel pixel detector concept

We started an R&D programme towards a novel pixel module concept for the high luminosity phase at the LHC (SLHC).

As an option to replace the bump bonding process, the pixel sensor will be connected to the read-out electronics by the novel Solid-Liquid InterDiffusion (SLID) interconnection process developed by the Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, offering finer segmentation and potentially lower cost.

In addition, using ICV-SLID, namely Inter-Chip Vias together with the SLID process, allows for a compact design, i.e. a higher live fraction and eventually for the vertical integration of analog and digital electronics made from different chip technologies. The interconnection technology will primarily be developed in conjunction with planar, radiation tolerant, thin pixel sensors, which will be 50--100 micrometer thin and produced using a wafer bonding technology, but also be applied to other sensor types. This pixel module concept opens new possibilities for the optimisation of radiation tolerance, power consumption, speed and complexity.

This R&D will be conducted by the Universities of Bonn, Dortmund and Oslo, Interon, and the MPP Munich.

This is the revised R&D proposal submitted to ATLAS in 2007, and links to the main references [1], [2], [3], [4], [5], [6], [7], [8] [9], [10], [11], [12] [13] [14], [15], [16], [17], [18], cited therein.

As it stands the R&D proposal is incomplete and we are looking for collaborators to join the proposed effort and contribute with their expertise. Please contact Richard Nisius or Hans-Günther Moser.